Solid-state imaging device, method of controlling solid-state imaging device, and imaging device

An imaging device in which first and second substrates are electrically connected to each other via connector, the imaging device comprising:

• a photoelectric conversion element;
• a read circuit that reads a signal generated by the photoelectric conversion element;
• and
• a signal processing circuit that includes elements or circuits performing signal processing on the signal read by each read circuit,
• wherein the photoelectric conversion element is disposed in the first substrate,
• wherein the read circuit is disposed in the second substrate and reads the signal generated by the photoelectric conversion element and transmitted via the connector, and
• wherein, in the signal processing circuit, some of elements or circuits included in the signal processing circuit are disposed in the first substrate, rest of the elements or the circuits included in the signal processing circuit are disposed in the second substrate, and the elements or the circuits disposed in the first substrate are electrically connected to the elements or the circuits disposed in the second substrate via the connector.

A solid-state imaging device in which first and second substrates are electrically connected to each other via connector, the solid-state imaging device comprising:

• a photoelectric conversion element;
• a read transistor of which one of a source and a drain receives a signal generated by the photoelectric conversion element and the other of the source and the drain outputs the signal;
• and
• a signal processing circuit that includes capacitors or transistors performing signal processing on the signal output by the read transistor,
• wherein the photoelectric conversion element is disposed in the first substrate,
• wherein the read transistor is disposed in the second substrate and outputs the signal generated by the photoelectric conversion element and transmitted via the connector, and
• wherein, in the signal processing circuit, some of the capacitors or the transistors included in the signal processing circuit are disposed in the first substrate, rest of the capacitors or the transistors included in the signal processing circuit are disposed in the second substrate, and the capacitors or the transistors disposed in the first substrate are electrically connected to the capacitors or the transistors disposed in the second substrate via the connector.

An imaging device in which first and second substrates are electrically connected to each other via connector, the imaging device comprising:

• a photoelectric conversion element;
• a read transistor of which one of a source and a drain receives a signal generated by the photoelectric conversion element and the other of the source and the drain outputs the signal;
• and
• a signal processing circuit that includes capacitors or transistors performing signal processing on the signal output by the read transistor,
• wherein the photoelectric conversion element is disposed in the first substrate,
• wherein the read transistor is disposed in the second substrate and outputs the signal generated by the photoelectric conversion element and transmitted via the connector, and
• wherein, in the signal processing circuit, some of the capacitors or the transistors included in the signal processing circuit are disposed in the first substrate, rest of the capacitors or the transistors included in the signal processing circuit are disposed in the second substrate, and the capacitors or the transistors disposed in the first substrate are electrically connected to the capacitors or the transistors disposed in the second substrate via the connector.