Package structures including discrete antennas assembled on a device
AssigneeIntel Corporation
InventorsTelesphor Kamgaing, Valluri R. Rao, Ofir Degani
Life of this patent
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Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.
Claims46
A method of forming a package structure comprising:
- forming a discrete antenna on a back side of a device, wherein the discrete antenna comprises an antenna substrate;
- forming a through antenna substrate via through the antenna substrate, wherein the through antenna substrate via is vertically disposed through the antenna substrate;
- coupling the through antenna substrate via with a through substrate via that is vertically disposed within the device;
- and
- coupling the device with a package substrate.
A package structure comprising:
- a discrete antenna disposed on a back side of a first device, wherein the discrete antenna comprises an antenna substrate;
- a through antenna substrate via, wherein the through antenna substrate via is vertically disposed through the antenna substrate;
- a through substrate via that is vertically disposed within the first device and coupled with the through antenna substrate via;
- and
- a package substrate coupled with an active side of the first device.
A package structure comprising:
- a discrete antenna disposed on a back side of a die, wherein the discrete antenna comprises an antenna substrate and the die comprises a radio;
- a radiating element horizontally disposed on a top portion of the discrete antenna;
- a through antenna substrate via, wherein the through antenna substrate via is vertically disposed through the antenna substrate and coupled with the radiating element;
- a through substrate via that is vertically disposed within the die and coupled with the through antenna substrate via;
- and
- a package substrate coupled with an active side of the die.
Dependencies are inferred from the claim text.