Ferrite ceramic composition, ceramic electronic component, and method for manufacturing ceramic electronic component

A ceramic electronic component comprising:

• a magnetic section including a ferrite material;
• and
• a conductive section containing Cu as a main constituent,
• the magnetic section being formed from a ferrite ceramic composition containing at least Fe, Mn, Cu, Zn, Mg, and Ni,
• wherein when a molar content x mol % of Fe in terms of Fe2O3 and a molar content y mol % of Mn in terms of Mn2O3 are represented by (x, y), the (x, y) falls within a region surrounded by A (25, 1), B (47, 1), C (47, 7.5), D (46, 7.5), E (46, 10), F (30, 10), G (30, 7.5), and H (25, 7.5), a molar content of Cu is 0.5 to 10.0 mol % in terms of CuO, a molar content of Zn is 1.0 to 35.0 mol % in terms of ZnO, and a molar content of Mg is 5.0 to 35.0 mol % in terms of MgO.

A method for manufacturing a ceramic electronic component, the method comprising the steps of:

• weighing a Fe compound, a Mn compound, a Cu compound, a Zn compound, a Mg compound, and a Ni compound so that when a molar content x mol % of Fe in terms of Fe2O3 and a molar content y mol % of Mn in terms of Mn2O2 are represented by (x, y), the (x, y) includes a region surrounded by A (25, 1), B (47, 1), C (47, 7.5), D (46, 7.5), E (46, 10), F (30, 10), G (30, 7.5), and H (25, 7.5), and a molar content of Cu is 0.5 to 10.0 mol % in terms of CuO, a molar content of Zn is 1.0 to 35.0 mol % in terms of ZnO, and a molar content of Mg is 5.0 to 35.0 mol % in terms of MgO;
• mixing and then calcining the weighed compounds to prepare a calcined powder;
• preparing a ceramic thin-layer body from the calcined powder;
• forming, on the ceramic thin-layer body, a conductive film containing Cu as a main constituent in a predetermined pattern;
• forming a laminated body by stacking the ceramic thin-layer body with the conductive film formed in a predetermined order;
• and
• firing the laminated body in a firing atmosphere at lower than or equal to an equilibrium oxygen partial pressure of Cu—Cu2O to co-fire the ceramic thin-layer body and the conductive film.