Package substrate with band stop filter and semiconductor package including the same
AssigneeSK hynix Inc.
InventorsByung Jun BANG, Sang Joon LIM, Ju Il EOM, Bok Kyu CHOI, Jin Hwan SONG
Life of this patent
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Abstract
According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.
Claims20
A package substrate, comprising:
- a band stop filter configured to be disposed on the package substrate,
- wherein the band stop filter comprises:
- a transmission line pattern;
- and
- a conductive stub pattern configured to be arranged along the transmission line pattern, wherein the conductive stub pattern is separated from the transmission line pattern.
A semiconductor package comprising a band stop filter which comprises:
- a transmission line pattern configured to be arranged on a package substrate;
- and
- a conductive stub pattern configured to be arranged along the transmission line pattern, wherein the conductive stub pattern is separated from the transmission line pattern.
A semiconductor package comprising a band stop filter configured to be disposed along an outer boundary line on a package substrate and to perform an electromagnetic shielding function,
- wherein the band stop filter comprises a transmission line pattern configured to function as an inductor element, and a conductive stub pattern configured to function as a capacitor element with the transmission line pattern.
Dependencies are inferred from the claim text.