Die-stacked memory device with reconfigurable logic

A method comprising:

• storing a configuration file at a configuration store of a die-stacked memory device, the die-stacked memory device comprising a set of one or more stacked memory dies comprising memory cell circuitry and comprising a set of one or more logic dies electrically coupled to the set of one or more stacked memory dies, the set of one or more logic dies comprising a reconfigurable logic device and a memory controller;
• programming the reconfigurable logic device to implement a programmed logic configuration represented by the configuration file;
• and
• operating the reconfigurable logic device to perform at least one data manipulation operation based on the programmed logic configuration.

A computer readable storage medium storing code that is operable to manipulate at least one computer system to perform a portion of a process to fabricate an integrated circuit (IC) package, the IC package comprising:

• a die-stacked memory device comprising:
• a set of one or more stacked memory dies implementing memory cell circuitry;
• and
• a set of one or more logic dies electrically coupled to the memory cell circuitry, the set of one or more logic dies comprising a reconfigurable logic device and a memory controller, wherein the reconfigurable logic device is to perform at least one data manipulation operation according to a programmed logic configuration of the reconfigurable logic device.