High bandwidth differential lead with device connection

A measuring system for measuring signals from an electrical device, the measuring system comprising:

• a solder-less lead including:
• a support bracket;
• an attachment mechanism structured to securely attach the support bracket to the device,
• a probe signal pad,
• a microspring housing,
• a microspring carried in the housing, a portion of the microspring extending beyond a surface of the microspring housing when the microspring is unsprung, and the microspring structured to electrically couple, on a first end, to one of the land patterns of the electrical device when the lead is attached to the device by the attachment mechanism, and couple to the probe signal pad on the second end;
• and
• a connector structured to be temporarily coupled to the solder-less lead, the connector comprising:
• a latch structured to temporarily couple to the support bracket of the lead,
• a microspring housing,
• a microspring carried in the housing, a portion of the microspring extending beyond a surface of the microspring housing when the microspring is unsprung, and the microspring structured to electrically couple to the probe signal pad of the lead when the connector is coupled to the lead.