Designed asperity contactors, including nanospikes for semiconductor test, and associated systems and methods

Abstract

Nano spike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a translator having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer-side sites are carried by the translator at the wafer side of the translator. The nanospikes can be attached to nanospike sites on a wafer side of a translator. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, the nanospikes can be formed by sputtering over a metal carrier with a photoresist mask. In particular embodiments, the nanospikes have generally conical cross-section.

Dependencies are inferred from the claim text.