Composite wire probe test assembly

A method of manufacturing a probe assembly, comprising:

• cleaning a substrate that includes a conductive trace;
• laminating a lamination layer onto the substrate to a depth of at least 30 μm;
• creating at least one cavity in the lamination layer;
• disposing solder paste over the lamination layer proximal the cavity;
• disposing at least one electrical probe into a holder.

A method of using a probe assembly to test a wafer, comprising:

• introducing the wafer into an integrated circuit test system with a plurality electrical contacts of the wafer exposed to the probe assembly;
• contacting an exposed electrical contact of the plurality with the probe assembly, the probe assembly including:
• a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining a cavity extending to the conductive trace;
• and
• an electrical probe disposed in the cavity, with solder paste coupling the electrical probe to the conductive trace, the electrical probe comprising:
• a high yield strength wire core including a refractory metal;
• a low electrical resistivity layer concentrically around the high yield strength wire core, the low electrical resistivity layer including predominantly one or more materials selected from silver, gold, copper, and combinations thereof;
• and
• a thin oxidation protection layer concentrically disposed around the low electrical resistivity layer and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof,
• wherein the solder paste fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer;
• and
• exchanging an electrical signal between the electrical probe and the exposed electrical contact.