Electronic devcie with chip-on-film package

An electronic device with chip-on-film package, comprising:

• a flexible substrate at least comprising a non-cutting-out area and a cutting-out area;
• a core circuit unit disposed in the non-cutting-out area;
• multiple output pads disposed in the non-cutting-out area, wherein the multiple output pads comprise a first output pad and a second output pad;
• multiple switching elements comprising a first switching element and a second switching element, wherein a first terminal and a second terminal of the first switching element are electrically connected to a first output terminal of the core circuit unit and the first output pad, respectively, and a first terminal and a second terminal of the second switching element are electrically connected to a second output terminal of the core circuit unit and the second output pad, respectively;
• and
• a common test pad disposed in the cutting-out area, wherein the common test pad is electrically connected to the output pads;
• wherein, in a test stage, the switching element are sequentially turned on such that one of multiple output signals of the core circuit unit is transmitted to the common test pad.