Apparatus for Three Dimensional Integrated Circuit Testing

A system comprising:

• a plurality of testing modules on an automatic testing equipment board;
• and
• a probe card coupled comprising:
• a plurality of known good dies of a three-dimensional integrated circuit;
• a plurality of interconnects of the three-dimensional integrated circuit;
• a printed circuit board coupled to the automatic testing equipment board;
• a testing substrate comprising a first group of probe contacts, wherein the first group of probe contacts are configured to couple the probe card with testing contacts of a first device-under-test of the three-dimensional integrated circuit;
• and
• a plurality of pogo pins, wherein:
• a first end of the pogo pin penetrates through the testing substrate;
• and
• a second end of the pogo pin is coupled to the printed circuit board.

A method comprising:

• bonding a plurality of known good dies of a three-dimensional integrated circuit on a probe card;
• forming a plurality of probe contacts on a testing substrate of the probe card, wherein the probe contacts are coupled to the known good dies through a plurality of interconnects, wherein the interconnects form a same system level connection as the three-dimensional integrated circuit;
• and
• performing a probing on a semiconductor die of a wafer through the probe card.