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US 2014/0175683 A1Published application
Aromatic polyamide films for solvent resistant flexible substrates
AssigneesAkron Polymer Systems, Inc., Sumitomo Bakelite Co., Ltd.
InventorsFrank W. HARRIS, Dong ZHANG, Limin SUN, Jiaokai JING, Hideo UMEDA, Jun OKADA
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Abstract
This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide, silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer.
Claims15
A solution of polyamide comprising:
- an aromatic polyamide and a solvent;
- wherein the aromatic polyamide comprises one or more functional groups that can react with an epoxy group.
A process for manufacturing a display element, an optical element or an illumination element, comprising the steps of:
- a) dissolving one or more aromatic diamines in a solvent,
- where at least one of the diamines contains one or more functional groups that can react with an epoxy group;
- b) reacting the diamine mixture with at least one aromatic diacid dichloride, wherein hydrochloric acid and a polyamide solution is generated;
- c) removing the free hydrochloric acid by reaction with an acid trapping reagent;
- d) adding a multifunctional epoxide;
- e) casting the resulting polyamide solution into a film onto a base at a temperature below approximately 200° C.;
- f) heating the polyamide film on the base at a temperature that results is the film becoming solvent resistant;
- and
- g) forming the display element, the optical element or the illumination element on the surface of the polyamide film.
6 more elements
Dependencies are inferred from the claim text.