Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements

An upper package configured to be stacked on a lower package in a package stack structure, the upper package comprising:

• an upper package substrate having a first edge and a second edge opposite to the first edge, the upper package substrate having a first region arranged near the first edge and a second region arranged near the second edge;
• and
• an semiconductor device disposed on a central region of the upper package substrate,
• the upper package substrate comprising:
• first to third inter-package connector lands on a lower surface of the upper package substrate,
• the first inter-package connector lands configured to transmit data signals,
• the second inter-package connector lands configured to transmit address/control signals, and
• the third inter-package connector lands configured to provide a supply voltage for the address/control circuit,
• wherein the first and second inter-package connector lands are disposed in the first region, and
• wherein the third inter-package connector lands are disposed in the second region.

A semiconductor package comprising:

• a package substrate, and a semiconductor device on the package substrate,
• wherein the package substrate comprises:
• first and second lands disposed near a left side of the package substrate;
• and
• third lands disposed near a right side of the semiconductor device,
• wherein the semiconductor device comprises:
• first and third pads disposed near a left side of the semiconductor device;
• and
• second pads disposed near a right side of the semiconductor devices,
• wherein:
• the first and second lands and the first and second pads are configured to transmit first and second electrical signals, and
• the third lands and the third pads are configured to provide a first reference voltage.