Semiconductor Device and Method of Manufacturing the Same
AssigneeRenesas Electronics Corporation
InventorsSoshi Kuroda, Kenya Hironaga, Hironori Matsushima, Masatoshi Yasunaga, Akira Yamazaki
Life of this patent
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Abstract
To achieve a reduction in cost of a semiconductor device, in a common board (a wiring board), a plurality of bonding leads each extend toward the center of the board, and a solder resist film as a die bonding region supporting a minimum chip is coated with a die bonding material. With this, even when a first semiconductor chip as a large chip is mounted, wire bonding can be performed without causing the die bonding material to cover the bonding leads. Thus, development cost can be reduced to reduce the cost of the semiconductor device (LGA).
Claims9
1-14. (canceled)
A semiconductor device comprising:
- a wiring board having an upper surface, a first insulating film formed in a region of the upper surface to be coated with a die bonding material, a second insulating film formed around the first insulating film, a plurality of bonding leads disposed around the first insulating film, a lower surface on an opposite side of the upper surface, and a plurality of lands formed on the lower surface;
- a semiconductor chip having a main surface and a plurality of electrode pads formed on the main surface, and being mounted on the first insulating film of the wiring board;
- the die bonding material disposed between the first insulating film of the wiring board and the semiconductor chip;
- and
- a plurality of metal wires each electrically connecting each of the plurality of bonding leads of the wiring board and each of the plurality of electrode pads of the semiconductor chip, wherein
- the first insulating film of the wiring board has an area smaller than an area of the semiconductor chip, and
- the first insulating film of the wiring board has a film thickness larger than a film thickness of the second insulating film.
22-25. (canceled)
Dependencies are inferred from the claim text.