Back to results
US 2014/0175677 A1Published application
Dicing tape-integrated film for semiconductor back surface
AssigneeNitto Denko Corporation
InventorsNaohide TAKAMOTO, Takeshi MATSUMURA, Goji SHIGA
Life of this patent
Estimating the term…
Abstract
The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.
Claims4
A dicing tape-integrated film for semiconductor back surface, comprising:
- a dicing tape comprising a base material and a pressure-sensitive adhesive layer provided on the base material;
- and
- a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer,
- wherein the film for flip chip type semiconductor back surface contains a black pigment.
1 more element
Dependencies are inferred from the claim text.