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US 2014/0175675 A1Published application
Devices and methods for stacking individually tested devices to form multi-chip electronic modules
AssigneeBAE Systems Information and Electronic Systems Integration Inc.
InventorsKeith K. Sturcken, John A. Hughes, Thomas E. Love, Sheila J. Konecke, Jeffrey Montag, Peter M. Wallace
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Abstract
A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.
Claims6
An electronic module comprising:
- a plurality of devices;
- and
- a plurality of substrates attached to the plurality of devices wherein the plurality of devices is tested prior to stacking at least six devices to form the electronic module.
Dependencies are inferred from the claim text.