Back to results
US 2014/0175674 A1Published application
Package on Package Device
AssigneeHuawei Device Co., Ltd.
InventorYu Chen
Life of this patent
Estimating the term…
Abstract
The present invention provides a package on package device. At least two components are sequentially soldered with each other. A size of a base plate of a component located below is greater than a size of an edge of a component located above. In the case of a package on package device, the size of the base plate of the component located below is greater than the size of the edge of the component located above.
Claims19
1-6. (canceled)
A package on package device, comprising:
- a first component having a base plate;
- and
- a second component soldered on the first component, wherein a size of the base plate of the first component is greater than a size of an edge of the second component.
A package on package device, comprising:
- a first component having an upper surface having a first surface area, edges of the first component including protrusions upwards surrounding the upper surface;
- a second component overlying the first component, wherein a lower surface of the second component has a second surface area that is smaller than the first surface area, edges of the second component being laterally spaced from the edges of the first component;
- a plurality of solder connections between the lower surface of the second component and the upper surface of the first component;
- and
- a glue material between the lower surface of the second component and the upper surface of the first component, the glue being laterally bounded by the protrusions at the edges of the first component.
2 more elements
Dependencies are inferred from the claim text.