Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same

A hybrid substrate with high density and low density substrate areas, comprising:

• a base substrate layer;
• a low density substrate layer formed on the base substrate layer and having a cavity formed at an intermediate area thereof and a low density area having a low pattern density around the cavity;
• a high density substrate layer mounted on the base substrate layer in the cavity of the low density substrate layer and constituted by a high density area having a higher pattern density than that of the low density area;
• an insulating support layer comprising a deposition area formed on the high density substrate layer and the low density substrate layer;
• insulating layer vias passing the deposition area of the insulating support layer and connected to patterns of the high density substrate layer and the low density substrate layer;
• and
• an outer pattern layer comprising circuit patterns connected to the insulating layer vias and formed on the deposition area of the insulating support layer.

A method of manufacturing a hybrid substrate with high density and low density substrate areas, comprising:

• preparing a low density substrate layer having a cavity formed at an intermediate area thereof and a low density area having a low pattern density around the cavity;
• mounting a high density substrate layer constituted by a high density area having a higher pattern density than that of the low density area in the cavity of the low density substrate layer;
• forming an insulating support layer comprising a deposition area in which the insulating material is deposited on upper portions, lower portions or the upper and lower portions of the high density substrate layer and the low density substrate layer;
• forming insulating layer via-holes passing through the deposition area of the insulating support layer and configured to expose patterns of the high density substrate layer and low density substrate layer;
• and
• forming an outer pattern layer by filling the insulating layer via-holes to form insulating layer vias and forming circuit patterns on the deposition area of the insulating support layer to be connected to the insulating layer vias.

A method of manufacturing a hybrid substrate with high density and low density substrate areas, comprising:

• preparing a base substrate layer;
• forming a low density substrate layer having a cavity formed in an intermediate area thereof and a low density area having a low pattern density around the cavity on the base substrate layer;
• mounting a high density substrate layer constituted by a density area having a higher pattern density than that of the low density area on the base substrate layer in the cavity of the low density substrate layer;
• forming an insulating support layer comprising the deposition area on which the insulating material is deposited on the high density substrate layer and the low density substrate layer;
• forming insulating layer via-holes passing through the deposition area of the insulating support layer and configured to expose the patterns of the high density substrate layer and the low density substrate layer;
• and
• forming an outer pattern layer by filling the insulating layer via-holes to form insulating layer vias and forming circuit patterns on the deposition area of the insulating support layer to be connected to the insulating layer vias.