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US 2014/0175668 A1Published application
Semiconductor integrated circuit
AssigneeSK hynix Inc.
InventorSang Jin BYEON
Life of this patent
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Abstract
A semiconductor integrated circuit includes: a first interface block configured to transmit and receive signals within the same chip; a second interface block configured to transmit and receive signals to and from different semiconductor chips; and a switching block configured to select a signal path in which the signal transmission and reception of the first interface block is not performed through the second interface block, in response to a chip structure signal.
Claims20
A semiconductor integrated circuit comprising:
- a first interface block configured to transmit and receive signals within a same semiconductor chip;
- a second interface block configured to transmit and receive signals to and from different semiconductor chips;
- and
- a switching block configured to select a signal path in which the signal transmission and reception of the first interface block is not performed through the second interface block, in response to a chip structure signal.
1 more element
A semiconductor integrated circuit comprising:
- one or more memory banks;
- a first interface block configured to transmit and receive signals to and from the memory bank;
- a second interface block configured to transmit and receive signals to and from different semiconductor chips;
- and
- a switching block configured to select a signal path in which the signal transmission/reception of the first interface block is performed without passing through the second interface block when the semiconductor integrated circuit has a single chip structure, and select a signal path in which the signal transmission/reception of the first interface block is performed through the second interface block when the semiconductor integrated circuit has a multi-chip structure.
2 more elements
Dependencies are inferred from the claim text.