Integrated circuit device with stitched interposer
AssigneeAltera Corporation
InventorsArifur Rahman, Wai-Bor Leung
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Abstract
Systems, methods, and devices are provided to enable an integrated circuit device of relatively higher capacity. Such an integrated circuit device may include at least two component integrated circuits that communicate with one another. Specifically, the component integrated circuits may communicate through a “stitched silicon interposer” that is larger than a reticle limit of the lithography system used to manufacture the interposer. To achieve this larger size, the stitched silicon interposer may be composed of at least two component interposers, each sized within the reticle limit and each separated from one another by a die seal structure.
Claims21
An integrated circuit device comprising:
- first and second component integrated circuits configured to communicate with one another;
- and
- a contiguous interposer comprising chip-to-chip interconnects to facilitate communication between the first and second component integrated circuits, wherein the interposer is larger than a reticle limit of a lithography system used to manufacture the interposer.
6-10. (canceled)
An integrated circuit device comprising:
- a first integrated circuit device;
- a daughter die configured to support the first integrated circuit device;
- and
- an interposer configured to provide chip-to-chip interconnects between the first integrated circuit and the daughter die, wherein the interposer comprises at least two non-overlapping component interposers separated from one another by a die seal structure.
An integrated circuit device comprising:
- a contiguous stitched interposer comprising:
- a first component interposer comprising first chip-to-chip interconnects;
- a second component interposer comprising second chip-to-chip interconnects;
- and
- a die seal structure disposed between the first component interposer from the second component interposer through which no chip-to-chip interconnects cross;
- a first component integrated circuit disposed over the first component interposer and the second component interposer and electrically coupled to the first chip-to-chip interconnects and the second chip-to-chip interconnects;
- and
- a second component integrated circuit disposed over the first component interposer and the second component interposer and electrically coupled to the first chip-to-chip interconnects and the second chip-to-chip interconnects;
- wherein the first and second component integrated circuits are configured to communicate with one another via the first chip-to-chip interconnects and the second chip-to-chip interconnects.
A system comprising:
- a processor;
- and
- an integrated circuit device configured to operate on data from the processor, wherein the integrated circuit device comprises at least two component integrated circuits configured to intercommunicate via a stitched interposer that comprises at least two component interposers with non-overlapping sets of chip-to-chip interconnects.
A silicon interposer configured to facilitate communication between two integrated circuit chips, comprising:
- a first component interposer;
- a second component interposer;
- and
- a die seal structure configured to separate the first and second component interposers.
A silicon interposer comprising features patterned using a 20 nm lithography system, wherein the silicon interposer exceeds 26 mm×32 mm.
Dependencies are inferred from the claim text.