Chip package using interposer substrate with through-silicon vias
AssigneeNVIDIA Corporation
InventorTeckgyu KANG
Life of this patent
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Abstract
A microelectronic package includes an interposer with through-silicon vias that is formed from a semiconductor substrate and one or more semiconductor dies coupled to the interposer. A first signal redistribution layer formed on the first side of the interposer electrically couples the one or more semiconductor dies to the through-silicon vias. A second redistribution layer is formed on a second side of the interposer, and is electrically coupled to the through-silicon vias. In some embodiments, a mold compound is connected to an edge surface of the interposer and is configured to stiffen the microelectronic package.
Claims20
A microelectronic package, comprising:
- an interposer that is formed from a semiconductor substrate and includes a plurality of through-silicon vias;
- a semiconductor die coupled to a first surface of the interposer;
- and
- a mold compound connected to an edge surface of the interposer and configured to stiffen the microelectronic package.
A microelectronic package, comprising:
- an interposer that is formed from a semiconductor substrate and includes a plurality of through-silicon vias;
- a semiconductor die coupled to a first side of the interposer;
- a first redistribution layer that is formed on the first side of the interposer and is configured to electrically couple the semiconductor die to the plurality of through-silicon vias included in the interposer;
- and
- a second redistribution layer that is formed on a second side of the interposer and is configured to be electrically coupled to the through-silicon vias included in the interposer,
- wherein the first side of the interposer is opposite to the second side of the interposer.
Dependencies are inferred from the claim text.