Electronic device including electrically conductive vias having different cross-sectional areas and related methods
AssigneeStmicroelectronics Pte Ltd
InventorsYonggang Jin, Yun Liu, Yaohuang Huang
Life of this patent
Estimating the term…
Abstract
An electronic device may include a bottom interconnect layer having a first electrically conductive via therein. The electronic device may also include an integrated circuit (IC) carried by said bottom interconnect layer, and an encapsulation material on the bottom interconnect layer and surrounding the IC. The encapsulation layer may have a second electrically conductive via therein aligned with the first electrically conductive via. The second electrically conductive via may have a cross-sectional area larger than a cross-sectional area of the first electrically conductive via.
Claims24
An electronic device comprising:
- a bottom interconnect layer having a first electrically conductive via therein;
- an integrated circuit (IC) carried by said bottom interconnect layer;
- and
- an encapsulation material on said bottom interconnect layer and surrounding said IC and having a second electrically conductive via therein aligned with said first electrically conductive via, said second electrically conductive via having a cross-sectional area being larger than a cross-sectional area of said first electrically conductive via.
An electronic device comprising:
- a bottom interconnect layer having a first electrically conductive via therein;
- a plurality of bottom contacts carried by said bottom interconnect layer;
- an integrated circuit (IC) comprising a semiconductor substrate having a plurality of bond pads coupled to said bottom interconnect layer;
- and
- an encapsulation material on said bottom interconnect layer and surrounding said IC and having a second electrically conductive via therein aligned with said first electrically conductive via, said second electrically conductive via having a cross-sectional area being larger than a cross-sectional area of said first electrically conductive via.
A method of making an electronic device comprising:
- coupling an integrated circuit (IC) to a bottom interconnect layer;
- forming a first electrically conductive via in the bottom interconnect layer;
- positioning an encapsulation material on the bottom interconnect layer to surround the IC;
- and
- forming a second electrically conductive via in the encapsulation material aligned with the first electrically conductive via, the second electrically conductive via having a cross-sectional area being larger than a cross-sectional area of the first electrically conductive via.
Dependencies are inferred from the claim text.