Methods of forming ultra thin package structures including low temperature solder and structures formed therby
AssigneeIntel Corporation
InventorsSriram Srinivasan, Ram S. Viswanath, Paul R. Start, Rajen S. Sidhu, Rajasekaran Swaminathan
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Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage, attaching the assembled device and patch substrate to an interposer to form a package structure, and then reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.
Claims30
A method of forming a structure comprising:
- attaching a device to a patch substrate, wherein the assembled device and patch substrate comprise a warpage;
- attaching the assembled device and patch substrate to a substrate to form a package structure;
- and
- reflowing the package structure at a temperature below about 200 degrees Celsius to form a substantially flat package structure.
The method of claim further comprising wherein the warpage comprises up to about 300 microns.
A package structure comprising:
- a device disposed on a patch substrate;
- a substrate coupled to the patch substrate;
- and
- solder balls coupling the substrate to the patch substrate,
- wherein the solder balls comprise a low melting temperature tin bismuth alloy.
A package structure comprising:
- a die coupled to a patch substrate;
- an interposer coupled to the patch substrate;
- and
- solder balls coupling the interposer to the patch substrate,
- wherein the solder balls comprise a tin bismuth alloy comprising a melting temperature below about 200 degrees Celsius.
Dependencies are inferred from the claim text.