Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same
AssigneeSK hynix Inc.
InventorsJi Eun KIM, Cheol Ho JOH, Hee Min SHIN, Kyu Won LEE, Chong Ho CHO
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Abstract
The semiconductor package includes an upper semiconductor chip stacked on a package substrate and a support layer or a lower semiconductor chip disposed between the upper semiconductor chip and the package substrate. The upper semiconductor chip includes a protrusion downwardly extending from an edge thereof. The protrusion of the upper semiconductor chip is combined with a sidewall of the support layer or the lower semiconductor chip. Related methods are also provided.
Claims20
A semiconductor package comprising:
- an upper semiconductor chip stacked on a package substrate, including a protrusion downwardly extending from an edge thereof;
- and
- a support layer or a lower semiconductor chip between the upper semiconductor chip and the package substrate,
- wherein the protrusion of the upper semiconductor chip is combined with a sidewall of the support layer or the lower semiconductor chip.
A semiconductor package comprising:
- a package substrate;
- a first stack structure including a plurality of semiconductor chips vertically stacked on the package substrate and laterally shifted in a first direction;
- and
- a second stack structure including a plurality of semiconductor chips vertically stacked on the first stack structure and laterally shifted in an opposite direction to the first direction,
- wherein each of the semiconductor chips of the first and second stack structures includes a protrusion downwardly extending from an edge thereof wherein one of the protrusions is combined with a sidewall of the underlying semiconductor chip or a support layer disposed thereunder.
The semiconductor package 11, wherein each of the semiconductor chips further includes a bonding pad disposed on a first surface thereof and the protrusion of each of the semiconductor chips is disposed on a second surface of the semiconductor chip opposite to the first surface.
Dependencies are inferred from the claim text.