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US 2014/0175637 A1Published application
Back-to-back stacked integrated circuit assembly and method of making
AssigneeIo Semiconductor, Inc.
InventorsMichael A. Stuber, Stuart B. Molin
Life of this patent
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Abstract
An integrated circuit assembly includes a first substrate and a second substrate, with active layers formed on the first surfaces of each substrate, and with the second surfaces of each substrate coupled together. A method of fabricating an integrated circuit assembly includes forming active layers on the first surfaces of each of two substrates, and coupling the second surfaces of the substrates together.
Claims26
An integrated circuit assembly comprising:
- a first substrate having a first surface and a second surface,
- a first active layer formed on the first surface of the first substrate, the first active layer including a first metal bond pad;
- a second substrate having a first surface and a second surface, the second surface of the first substrate being coupled to the second surface of the second substrate, and
- a second active layer formed on the first surface of the second substrate, the second active layer including a second metal bond pad.
1 more element
A method of forming an integrated circuit assembly, the method comprising:
- providing a first substrate having a first surface and a second surface;
- forming a first active layer on the first surface of the first substrate;
- providing a second substrate having a first surface and a second surface, wherein the second substrate includes a second active layer formed on the first surface of the second substrate;
- and
- coupling the second surface of the second substrate to the second surface of the first substrate.
2 more elements
Dependencies are inferred from the claim text.