US 2014/0175634 A1 · METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMPS AND STRUCTURES FORMED THEREBY

Abstract

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

Claims37

Dependent claims

A method of forming a package structure comprising:

forming an underfill material on conductive bumps of the package structure, wherein the underfill material comprises a thiol based adhesion promoter, wherein the thiol based adhesion promoter comprises a molecular molecular weight above about 150 g/mol.

Dependencies are inferred from the claim text.

Facts

Application

13/721,266Filed 20 Dec 2012

Published

26 Jun 2014

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H10W 74/012
Manufacture or treatment: of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
H10W 74/15
Characterised by their shape or disposition: on active surfaces of flip-chip devices, e.g. underfills
H10W 74/47
Characterised by their materials: comprising organic materials, e.g. plastics or resins

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

Life of this patent

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

Life of this patent

Abstract

Claims37