Three-dimensional integrated circuit
AssigneeNational Chiao Tung University
InventorsAn-Nan Tan, Hung-Ming Chen, Kuan-Neng Chen
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Abstract
A three-dimensional integrated circuit, including a first adhesive bonding layer, a first chip, a second chip, and an inter-stratum thermal pad, is provided. The first adhesive bonding layer has a first surface and a second surface opposite to each other. The first chip is disposed on the first surface of the first adhesive bonding layer. The first chip includes a hot zone. The second chip is disposed on the second surface of the first adhesive bonding layer. The inter-stratum thermal pad is embedded in the first adhesive bonding layer and faces to the hot zone.
Claims14
A three-dimensional integrated circuit, comprising:
- a first adhesive bonding layer comprising a first surface and a second surface opposite to each other;
- a first chip disposed on the first surface of the first adhesive bonding layer and comprising a hot zone;
- a second chip disposed on the second surface of the first adhesive bonding layer;
- and
- an inter-stratum thermal pad embedded in the first adhesive bonding layer and facing to the hot zone.
Dependencies are inferred from the claim text.