Semiconductor module having sliding case and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Ki LEE, Kwang Soo KIM, Young Hoon KWAK, Sun Woo YUN
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Abstract
There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.
Claims14
A semiconductor module comprising:
- a module substrate on which at least one electronic element is mounted;
- at least one external connection terminal fastened to the module substrate;
- and
- a case formed by coupling a first case and a second case, wherein:
- the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other,
- the case includes at least one moving slit in which the external connection terminal is disposed when the first case and the second case are coupled to each other, and
- the moving slit includes at least one fixing projection inwardly protruded in such a manner that a width of the moving slit is reduced, in a side thereof in which the external connection terminal is finally disposed.
(canceled)
(canceled)
A semiconductor module comprising:
- a module substrate on which at least one electronic element is mounted;
- at least one external connection terminal fastened to the module substrate;
- and
- a case formed by accommodating the module substrate in a first case and a second case and coupling the module substrate and the first case and the second case, wherein:
- the module substrate is inserted into the first case and the second case in a sliding manner and coupled to the first case and the second case,
- the case includes at least one moving slit in which the external connection terminal is disposed when the first case and the second case are coupled to each other, and
- the moving slit includes at least one fixing projection inwardly protruded in such a manner that a width of the moving slit is reduced, in a side thereof in which the external connection terminal is finally disposed.
A method of manufacturing a semiconductor module, the method comprising:
- mounting at least one electronic element and at least one external connection element on a module substrate;
- disposing a first case and a second case at both ends of the module substrate;
- and
- coupling the first case and the second case to the module substrate by moving the first case and the second case so as to contact each other, wherein:
- the first case and the second case include at least one moving slit in which the external connection terminal is disposed when the first case and the second case are coupled to each other, and
- the moving slit includes at least one fixing projection inwardly protruded in such a manner that a width of the moving slit is reduced, in a side thereof in which the external connection terminal is finally disposed.
Dependencies are inferred from the claim text.