Semiconductor Package with Multiple Conductive Clips

A semiconductor package comprising:

• a control transistor disposed on a leadframe and including a bottom surface having a control source and a control gate and a top surface having a control drain;
• a sync transistor disposed on said leadframe and including a bottom surface having a sync drain and a top surface having a sync source and a sync gate;
• a conductive clip electrically coupling said sync source to a pad of said leadframe, said control source being electrically coupled to said sync drain by a common region of said leadframe;
• said driver IC disposed on another pad of said leadframe, said another pad isolated from said common region;
• said pad disposed on a common side of said leadframe opposite of said another pad.

A semiconductor package comprising:

• a control transistor disposed on a leadframe and including a bottom surface having a control source and a top surface having a control drain;
• a sync transistor disposed on said leadframe and including a bottom surface having a sync drain and a top surface having a sync source;
• a driver integrated circuit (IC) disposed on said leadframe and driving said control transistor and said sync transistor;
• a conductive clip electrically coupling said control drain to a pad of said leadframe;
• said driver IC disposed on another pad of said leadframe;
• said pad disposed on a common side of said leadframe opposite of said another pad.