Lead frame having a perimeter recess within periphery of component terminal
AssigneeIntersil Americas Inc.
InventorsRandolph Cruz, Loyde M. Carpenter, JR.
Life of this patent
Estimating the term…
Abstract
Embodiments described herein relate to manufacturing a device. The method includes etching at least one recess pattern in an internal surface of a lead frame, the at least one recess pattern including a perimeter recess that defines a perimeter of a mounting area. The method also includes attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached in the mounting area and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal.
Claims20
A method of manufacturing a device, the method comprising:
- etching at least one recess pattern in an internal surface of a lead frame, the at least one recess pattern including a perimeter recess that defines a perimeter of a mounting area;
- and
- attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached in the mounting area and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal.
A packaged circuit comprising:
- a lead frame including at least one recess pattern on an internal surface thereof, the at least one recess pattern including a perimeter recess that defines a perimeter around one or more raised surfaces;
- a component having one or more terminals, one of the terminals mounted to the one or more raised surfaces such that the terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the terminal;
- and
- component attach adhesive between the single terminal of the component and the one or more raised surfaces of the lead frame.
A method of manufacturing a device, the method comprising:
- etching a recess pattern in an internal surface of a lead frame, the recess pattern including a perimeter recess that defines a perimeter around one or more raised surfaces;
- placing component attach adhesive on the one or more raised surfaces;
- attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached to the one or more raised surfaces and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal;
- and
- applying molding compound on the lead frame and around the component.
Dependencies are inferred from the claim text.