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US 2014/0175626 A1Published application
Integrated circuit package and method of manufacture
AssigneeTexas Instruments Incorporated
InventorsDonald C. Abbott, Ubol A. Udompanyavit, Brian E. Parks
Life of this patent
Estimating the term…
Abstract
An integrated circuit package has a leadframe having an open space extending therethrough. An integrated circuit device is attached to a portion of the upper surface of the leadframe. A shunt is located within the open space such that it is not in contact with any portion of the leadframe.
Claims6
1-20. (canceled)
An integrated circuit package comprising:
- a lead frame having an upper surface, an oppositely disposed lower surface and at least one opening extending through the leadframe from said upper surface to said lower surface;
- an integrated circuit device attached to a portion of said upper surface of said leadframe;
- and
- a shunt positioned at least partially in said opening, wherein, said shunt is not in contact with any portion of said leadframe.
1 more element
Dependencies are inferred from the claim text.