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US 2014/0175625 A1Published application
Semiconductor device including at least one element
AssigneeInfineon Technologies AG
InventorsThorsten Meyer, Jens Pohl
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element, and a mold material at least partially covering the chip and the adhesive.
Claims20
A semiconductor device comprising:
- a chip;
- at least one element electrically coupled to the chip;
- an encapsulation material at least partially covering the chip, the encapsulation material directly contacting the chip;
- and
- a planar redistribution layer consisting of one or more conductive traces and an insulating material, one of the conductive traces contacting the chip and the at least one element,
- wherein the at least one element is laterally adjacent to the chip along a direction that is in a plane of an active surface of the chip.
3 more elements
A wafer level package comprising:
- a semiconductor die;
- a component;
- a planar redistribution layer consisting of one or more conductive traces and an insulating material, one of the conductive traces contacting the semiconductor die and the component;
- and
- a material encapsulating at least one side of the semiconductor die and at least one side of the component,
- wherein the component is laterally adjacent to the semiconductor die with respect to the redistribution layer.
3 more elements
A semiconductor device comprising:
- a chip;
- at least one element electrically coupled to the chip;
- an encapsulant at least partially covering the chip, the encapsulant directly contacting the chip;
- and
- a planar redistribution layer consisting of conductive traces and an insulating material, one of the conductive traces contacting the chip and the at least one element,
- wherein the at least one element is laterally adjacent to the chip along a direction that is in a plane of an active surface of the chip.
3 more elements
Dependencies are inferred from the claim text.