Segmented conductive top layer for radio frequency isolation

A method of providing RF shielding for a plurality of devices, the method comprising:

• providing a substrate;
• positioning a plurality of radio frequency devices on the substrate;
• disposing a plurality of wirebond structures on the substrate between first and second devices of the plurality of radio frequency devices;
• forming a first conductive ground layer;
• electrically connecting the plurality of wirebond structures to the first conductive ground layer;
• forming a molding dimensioned to encapsulate the first and second devices and at least a portion of each of the plurality of wirebond structures;
• forming a first conductive top layer at least partially above the first device on a first portion of a top surface of the molding, the first conductive top layer electrically contacting the plurality of wirebond structures such that the first conductive ground layer, the plurality of wirebond structures, and the first conductive top layer at least partially form a radio frequency barrier between the first device and the second device;
• and
• forming a second conductive top layer at least partially above the second device on a second portion of the top surface of the molding, the second conductive top layer being at least partially electrically isolated from the first conductive top layer.

A wireless device comprising:

• a first antenna;
• a second antenna;
• a radio frequency (RF) module including a first switching device electrically coupled to the first antenna and a second switching device electrically coupled to the second antenna;
• a plurality of wirebond structures disposed between the first and second switching devices
• a conductive ground layer disposed at least partially below the first switching device;
• and
• a first conductive top layer disposed at least partially above the first switching device and in electrical contact with the plurality of wirebond structures such that the first conductive ground layer, the plurality of wirebond structures, and the first conductive top layer form a radio frequency barrier between the first switching device and the second switching device;
• and
• a second conductive top layer disposed at least partially above the second switching device, the second conductive top layer being at least partially electrically isolated from the first conductive top layer.