Systems and methods for providing intramodule radio frequency isolation
AssigneeSkyworks Solutions, Inc.
InventorsHoward E. Chen, Matthew Sean Read, Anthony James LoBianco, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang
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Abstract
A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices.
Claims20
An apparatus comprising:
- a substrate;
- first and second radio frequency (RF) devices mounted on a surface of the substrate;
- a first conductive ground layer disposed at least partially below the first radio frequency device;
- a first plurality of wirebond structures disposed on the substrate between the first radio frequency device and the second radio frequency device;
- a molding dimensioned to encapsulate the first and second radio frequency devices and at least a portion of the first plurality of wirebond structures;
- and
- a first conductive top layer at least partially disposed above the first radio frequency device and in electrical contact with one or more of the first plurality of wirebond structures such that the first conductive ground layer, the one or more of the first plurality of wirebond structures, and the first conductive top layer at least partially form a radio frequency barrier between the first radio frequency device and the second radio frequency device.
A method of providing RF shielding for a plurality of devices, said method comprising the steps of:
- providing a substrate;
- positioning a plurality of radio frequency devices on the substrate;
- disposing a first plurality of wirebond structures on the substrate between first and second devices of the plurality of radio frequency devices;
- and
- connecting the first plurality of wirebond structures between a conductive top layer and a conductive ground layer such that the first plurality of wirebond structures, at least a portion of the conductive top layer, and at least a portion of the conductive ground layer at least partially form a radio frequency barrier between the first device and the second device.
A wireless device comprising:
- a first antenna;
- a second antenna;
- a radio frequency (RF) module including a first switching device electrically coupled to the first antenna and a second switching device electrically coupled to the second antenna;
- a conductive top layer disposed at least partially above the first switching device;
- a conductive ground layer disposed at least partially below the first switching device;
- and
- a plurality of wirebond structures disposed between the first and second switching devices and connected to the conductive top layer and conductive ground layer, the plurality of wirebond structures at least partially forming a radio frequency barrier between the first and second switching devices.
Dependencies are inferred from the claim text.