Vertically integrated systems
AssigneeAnalog Devices, Inc.
InventorsAlan J. O'DONNELL, Santiago IRIARTE, Mark J. MURPHY, Colin G. LYDEN, Gary CASEY, Eoin Edward ENGLISH
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Abstract
Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
Claims22
(canceled)
An integrated circuit system comprising:
- an active layer comprising an active circuit fabricated on a semiconductor die;
- a component layer comprising passive components and modifiable elements that are modifiable after assembly of the active layer with the component layer;
- and
- an electrical path coupling the active circuit of the active layer and at least one of the passive components of the component layer.
An integrated circuit system comprising:
- an active layer comprising an active circuit fabricated on a first side of a semiconductor die;
- a pre-fabricated layer on a second side of the semiconductor die, the second side opposing the first side, wherein the pre-fabricated layer comprises a first passive component and a second passive component embodied in a common substrate that is disposed on the second side of the semiconductor die;
- a first electrical path coupling the active layer and the first passive component of the pre-fabricated layer;
- and
- a second electrical path coupling the active layer and the second passive component of the pre-fabricated layer.
A method comprising:
- assembling an active layer and a component layer in a vertical stack, wherein the active layer comprises an active circuit, wherein the component layer comprises passive components and modifiable links, and wherein an electrical path couples the active circuit and at least one of the passive components;
- and
- subsequent to said assembling, modifying at least one of the modifiable links of the component layer to tune performance of an integrated circuit system that includes the vertical stack.
Dependencies are inferred from the claim text.