Suspension and absorber structure for bolometer
AssigneeRobert Bosch GmbH
InventorsFabian Purkl, Gary Yama, Ando Lars Feyh
Life of this patent
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Abstract
A semiconductor device includes a substrate having an upper surface that defines a sensing region. A fixed beam structure is supported at a first level above the sensing region. The fixed beam structure includes fixed beam supports that extend upwardly from the upper surface of the substrate to position the fixed beam structure at the first level above the sensing region. An absorber structure is supported above the fixed beam structure at a second level above the sensing region. The absorber structure includes a pillar support that extends upwardly from the fixed beam structure to position the absorber structure at the second level above the sensing region.
Claims20
A semiconductor device comprising:
- a substrate having an upper surface that defines a sensing region;
- a fixed beam structure supported at a first level above the sensing region, the fixed beam structure including fixed beam supports that extend upwardly from the upper surface of the substrate to position the fixed beam structure at the first level above the sensing region;
- an absorber structure supported above the fixed beam structure at a second level above the sensing region, the absorber structure including a pillar support that extends upwardly from the fixed beam structure to position the absorber structure at the second level above the sensing region.
A method of fabricating a semiconductor device, the method comprising:
- depositing a first sacrificial layer onto a patterned conductive layer provided on an upper surface of a substrate, the first sacrificial layer having an upper surface at a first level above the substrate;
- patterning the first sacrificial layer to define anchor holes that extend down to the patterned conductive layer;
- depositing a first conductive material onto the first sacrificial layer and in the anchor holes to form a fixed beam structure and fixed beam supports, respectively, the fixed beam structure being at the first level above the substrate;
- depositing at least one additional sacrificial layer on the first conductive material, the at least one additional sacrificial layer having an upper surface at a second level above the substrate;
- patterning the at least one additional sacrificial layer to form a pillar hole that extends down to the fixed beam structure;
- depositing a second conductive material onto the at least one additional sacrificial layer and in the pillar hole to form an absorber structure and a pillar support, respectively, the absorber structure being at the second level above the substrate.
Dependencies are inferred from the claim text.