Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin region

A method for manufacturing a micromechanical system, comprising:

• forming a shallow trench within a substrate;
• creating at least one of an oxide layer and a nitride layer as an isolation within the shallow trench;
• doping at least a portion of the substrate within the shallow trench over the isolation;
• depositing and structuring a sacrificial layer within the shallow trench over the structured sacrificial layer;
• depositing a structural material within the shallow trench;
• structuring the structural material and concurrently forming at least one hole in the structural material that is adjacent to a lateral edge of the sacrificial layer, the at least one hole giving access to the sacrificial layer;
• removing the sacrificial layer by accessing the same through the at least one hole in the structural layer;
• and
• closing the at least one hole and concurrently filling a relatively small portion of the cavity beneath the at least one hole with a material that is used for closing the at least one hole, thereby maintaining a major portion of the cavity.

A micromechanical system comprising:

• a substrate;
• a structural material;
• a cavity between the substrate and the structural material;
• a filled hole extending through the structural material in a direction perpendicular to a main surface of the substrate at a lateral position just outside the cavity, wherein the filled hole is filled with a first material;
• and
• a pillar of the first material extending between the filled hole and the substrate and being adjacent to the cavity.

A microelectromechanical transducer comprising:

• a substrate;
• a cavity formed within the substrate and bounded by a bottom and a sidewall;
• a support structure mechanically connected to the substrate or being a part of the substrate;
• a mechanical transducer component supported by the support structure and having a deflectable portion extending over at least a portion of the cavity, wherein a filled hole filled with a first material extends through the mechanical transducer component at a transition from the deflectable portion to a remaining portion of the mechanical transducer component;
• and
• a plug of the first material adjacent to the filled hole at a cavity side end of the filled hole and in contact with at least one of the bottom and the sidewall of the cavity.