Vertically integrated systems

An integrated circuit system comprising:

• a first layer comprising an active circuit of a semiconductor die;
• a second layer comprising a circuit element on the semiconductor die;
• an electrical path coupling the circuit element to the active circuit;
• and
• a third layer stacked vertically with the first layer and the second layer, the third layer comprising a microelectromechanical systems (MEMS) component, wherein the third layer is in communication with the semiconductor die.

An electronic device comprising:

• a circuit board;
• and
• a vertically integrated circuit on the circuit board, the vertically integrated circuit comprising:
• a first layer comprising an active circuit of a semiconductor die;
• a second layer comprising a circuit element on the semiconductor die;
• an electrical path coupling the circuit element to the active circuit;
• and
• a third layer stacked vertically with the first layer and the second layer, the third layer comprising a microelectromechanical systems (MEMS) component, wherein the third layer is in communication with the semiconductor die.

An integrated circuit system comprising:

• a first layer fabricated on a semiconductor die, wherein the first layer comprises active circuit elements;
• a second layer on the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive circuit element;
• an electrical path coupling the first layer and the second layer;
• and
• a third layer comprising a sensing element configured to receive an input from a source remote to the system by way of a remote sensing conduit, wherein the third layer is stacked vertically with the first layer and the second layer, and wherein the sensing element is in communication with a circuit element in at least one of the first layer or the second layer.