Curable silicone resin composition, cured product thereof and photosemiconductor apparatus

A curable silicone resin composition which is an addition-curable silicone composition and comprises

• (A)
• (A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1),
• wherein R1 represents an aliphatic unsaturated group, R2s may be the same or different from each other and each represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms other than an aliphatic unsaturated group, Rf1 represents a CF3—(CF2)m—(CH2)n— group
• where “m” represents an integer of 0 or more, and “n” represents an integer of 1 or more,
• “a” represents an integer of 1 to 3, and “x”, “y” and “z” are each an integer of x≧0, y≧1 and z≧0, respectively,
• (B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group,
• (C) a hydrosilylation catalyst containing a platinum group metal, and
• (D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 μm based on 100 parts by mass of the total Components (A) and (B).