Led package structure, dam structure thereof, and method of manufacturing led package thereof
AssigneesLite-On Technology Corporation, Lite-On Electronics (Guangzhou) Limited
InventorKUO-MING CHIU
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Abstract
An LED package structure includes a carrier mounted with a plurality of LED chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second glue-layer is stacked on the first glue-layer. The second glue-layer has a height higher than that of the first glue-layer. The second glue-layer has a volume greater than that of the first glue-layer. The present invention also provides a method of LED package structure to stably produce a dam structure with uniform shape and high ratio of height/width.
Claims19
An LED package structure, comprising:
- a carrier having a top surface;
- at least one LED chip disposed on the top surface of the carrier;
- a dam structure disposed on the top surface of the carrier and enclosing the LED chip, the dam structure comprising
- a first glue-layer, and
- a second glue-layer disposed on the first glue-layer, wherein a height of the second glue-layer is greater than that of the first glue-layer, and a volume of the second glue-layer is greater than that of the first glue-layer;
- and
- an encapsulation resin disposed within the dam structure for encapsulating the LED chip.
A manufacturing method of LED package structure, comprising the following steps:
- disposing a first glue-layer on a top surface of a carrier by a dispenser using a first height setting and a first pressure setting, wherein the first height setting represents a distance between a dispenser tip of the dispenser and the top surface of the carrier;
- and
- disposing a second glue-layer on the first glue-layer by the dispenser using a second height setting and a second pressure setting, wherein the second height setting represents the distance between the dispenser tip and the top surface of the carrier;
- wherein the second height setting is greater than the first height setting, the second pressure setting is greater than the first pressure setting, and a volume of the second glue-layer is greater than that of the first glue-layer.
Dependencies are inferred from the claim text.