Optoelectronic semiconductor component
AssigneeOSRAM Opto Semiconductors GmbH
InventorGertrud Kräuter
Life of this patent
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Abstract
An optoelectronic semiconductor component includes at least one radiation-emitting semiconductor chip including a radiation-outcoupling face through which at least some of electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip; and at least one radiation-transmissive body arranged at least in places downstream of the semiconductor chip on its radiation-outcoupling face, which body is in at least indirect contact with the semiconductor chip, wherein the radiation-transmissive body is formed with at least one polymer or contains at least one polymer, and one monomer of the polymer is formed with at least one silazane.
Claims13
An optoelectronic semiconductor component comprising:
- at least one radiation-emitting semiconductor chip comprising a radiation-outcoupling face, through which at least some of electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip;
- at least one radiation-transmissive body arranged at least in places downstream of the semiconductor chip on its radiation-outcoupling face, which body is in at least indirect contact with the semiconductor chip, wherein
- the radiation-transmissive body is formed with at least one polymer or contains at least one polymer, and
- one monomer of the polymer is formed with at least one silazane.
An optoelectronic semiconductor component comprising:
- at least one radiation-emitting semiconductor chip comprising a radiation-outcoupling face, through which at least some of electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip;
- and
- at least one radiation-transmissive body arranged at least in places downstream of the semiconductor chip on its radiation-outcoupling face, which body is in at least indirect contact with the semiconductor chip, wherein
- the radiation-transmissive body comprises traces of physical and/or mechanical material removal,
- the radiation-transmissive body is a lamina or a foil,
- at least one radiation-transmissive adhesion layer is arranged between the radiation-transmissive body and the radiation-outcoupling face, and
- the radiation-transmissive adhesion layer is formed with at least one polysilazane, comprises at least one polysilazane or consists of a polysilazane,
- the radiation-transmissive body is formed with at least one polymer or contains at least one polymer, and one monomer of the polymer is formed with at least one silazane.
Dependencies are inferred from the claim text.