Light emitting diode
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHIH-CHEN LAI
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Abstract
An LED includes an LED chip, a substrate, a first electrode and a second electrode formed on the LED chip, and a first solder layer and a second solder layer formed on a top face of the substrate. The first solder layer is soldered on the first electrode and sandwiched between the LED chip and the substrate. The second solder layer is soldered on the second electrode and sandwiched between the LED chip and the substrate. A projection of the first solder layer on the top face of the substrate exceeds a periphery of a projection of the LED chip on the top face of the substrate. A projection of the second solder layer on the top face of the substrate exceeds the periphery of the projection of the LED chip on the top face of the substrate.
Claims17
A light emitting diode, comprising:
- an LED (light emitting diode) chip;
- a substrate;
- a first electrode and a second electrode formed on the LED chip;
- and
- a first solder layer and a second solder layer formed on a top face of the substrate, the first solder layer being soldered on the first electrode and sandwiched between the LED chip and the substrate, the second solder layer being soldered on the second electrode and sandwiched between the LED chip and the substrate, a projection of the first solder layer on the top face of the substrate having at least a portion exceeding a periphery of a projection of the LED chip on the top face of the substrate, and a projection of the second solder layer on the top face of the substrate having at least a portion exceeding the periphery of the projection of the LED chip on the top face of the substrate.
Dependencies are inferred from the claim text.