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US 2014/0175498 A1Published application
Led chip unit with current baffle
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHIH-CHEN LAI
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Abstract
An LED chip unit includes a base and a chip mounted on the base. The chip includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer and an electrode. The base forms multiple conductive posts and current baffles therein. Widths of the current baffles gradually decrease from a central portion of the chip towards two lateral portions of the chip.
Claims18
Alight emitting diode (LED) chip unit comprising:
- a chip comprising a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer and an electrode;
- a base supporting the chip;
- and
- a plurality of current baffles formed at an interface of the chip and the base, wherein the interface comprises a first location corresponding to the electrode and a second location away from the first location, and sizes or densities, or both, of the current baffles decrease from the first location towards the second location.
1 more element
Dependencies are inferred from the claim text.