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US 2014/0175497 A1Published application
Led chip with groove and method for manufacturing the same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHIH-CHEN LAI
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Abstract
An LED chip includes a substrate and an epitaxy structure formed on the substrate. The epitaxy structure includes a first semiconductor layer, a light emitting layer and a second semiconductor layer. A plurality of grooves are defined through the first semiconductor layer, the light emitting layer and the second semiconductor layer. The light emitting layer is exposed from the grooves. A transparent insulative layer is filled in the grooves. An electrode is further formed on the transparent insulative layer.
Claims18
An LED (light emitting diode) chip comprising:
- a substrate;
- and
- an epitaxy structure comprising:
- a first semiconductor layer formed on the substrate;
- a light emitting layer formed on the first semiconductor layer;
- and
- a second semiconductor layer formed on the light emitting layer;
- wherein a plurality of grooves are defined in the epitaxy structure such that the light emitting layer is exposed from the grooves;
- and
- wherein a transparent insulative material is filled in the grooves.
7 more elements
A method for manufacturing an LED chip, comprising:
- making a substrate and an epitaxy structure formed on the substrate, the epitaxy structure comprising a first semiconductor layer, a light emitting layer and a second semiconductor layer;
- defining a plurality of grooves in the epitaxy structure to expose the light emitting layer;
- and
- filling a transparent insulative material in the grooves.
1 more element
Dependencies are inferred from the claim text.