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US 2014/0175496 A1Published application
Chip unit and method for manufacturing the same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHIH-CHEN LAI
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Abstract
A chip unit includes a base and two chips. Each chip includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer and an electrode. The substrate forms a groove in a bottom face thereof and two blocks besides the groove. The base forms a protrusion on a top face thereof and two slots besides the protrusion. The protrusion is fittingly received in the groove, and the two blocks are fittingly received in the two slots, respectively. A method for manufacturing the chip unit is also disclosed.
Claims20
A chip unit comprising:
- a chip comprising a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer;
- and
- a base;
- wherein the substrate has a first positioning structure facing the base, and the base has a second position structure facing the substrate, the first positioning structure being one of a protrusion and a groove, and the second positioning structure being the other one of the protrusion and the groove, the protrusion being fittingly received in the groove.
1 more element
A method for manufacturing a chip unit, comprising:
- making a base and a chip, the chip comprising a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer, the base having one of a protrusion and a groove, and the substrate having the other one of the protrusion and the groove;
- disposing the chip on the base by fitting the protrusion into the groove.
Dependencies are inferred from the claim text.