Back to results
US 2014/0175487 A1Published application
Light emitting device package
AssigneeSamsung Electronics Co., Ltd.
InventorSung-Uk ZHANG
Life of this patent
Estimating the term…
Abstract
A light emitting device package is provided. The light emitting device includes: a substrate; a light emitting device disposed at one side of the substrate; and a formation layer formed on the substrate and having a slope at an edge portion of the formation layer.
Claims20
A light emitting device package comprising:
- a substrate;
- a light emitting device disposed on one side of the substrate;
- and
- a formation layer disposed on the substrate and having a slope at an edge portion of the formation layer.
1 more element
A light emitting device package comprising:
- a substrate;
- a light emitting device disposed at a top of the substrate;
- and
- a reflective layer formed at a side of the light emitting device and the top of the substrate and having a slope at an edge portion of the reflective layer.
1 more element
A method of manufacturing a light emitting device package comprising:
- forming a light emitting device on one side of a substrate;
- forming a formation layer on the substrate;
- and
- forming a slope at an edge portion of the formation layer.
1 more element
Dependencies are inferred from the claim text.