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US 2014/0175480 A1Published application
Led die and method for manufacturing led incorporating the same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHIH-CHEN LAI
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Abstract
An LED die includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first electrode and a second electrode. A phosphor layer is formed on the second semiconductor layer. The phosphor layer has a constant thickness at a main light emitting face of the second semiconductor layer. A method for manufacturing an LED incorporating the die is also disclosed.
Claims18
An LED (light emitting diode) die comprising:
- a substrate;
- a first semiconductor layer formed on the substrate;
- a light emitting layer formed on the first semiconductor layer;
- a second semiconductor layer formed on the light emitting layer, the second semiconductor layer comprising a main light emitting face;
- and
- a phosphor layer covering the second semiconductor layer, the phosphor layer having a constant thickness on the main light emitting face of the second semiconductor layer.
3 more elements
A method for manufacturing an LED, comprising:
- providing a wafer comprising a substrate and a plurality of chips formed on the substrate, each chip comprising a first semiconductor layer, a light emitting layer and a second semiconductor layer, the second semiconductor layer having a main light emitting face;
- spreading a continuous phosphor layer on the wafer;
- flattening the phosphor layer to make the phosphor layer having a constant thickness on the main light emitting layer of the second semiconductor layer;
- cutting the substrate to form a plurality of individual dies, each die comprising a corresponding chip and a part of the substrate on which the corresponding chip is mounted and a part of the phosphor layer on the main light emitting face of the second semiconductor layer of the corresponding chip;
- electrically connecting each die with a base;
- and
- encapsulating each die to form the LED.
4 more elements
Dependencies are inferred from the claim text.