Edge coupling alignment using embedded features
AssigneeIntel Corporation
InventorsBrian H. Kim, Simon Lee
Life of this patent
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Abstract
Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame.
Claims30
A system comprising:
- a wireless radio component;
- a memory component coupled to the wireless radio component;
- a processing component coupled to the memory component;
- a semiconductor die coupled to the processing component, wherein the semiconductor die is to conduct data input/output (I/O) and includes a receiving alignment feature;
- and
- a mechanical part including a protruding alignment feature, wherein the semiconductor die overhangs a substrate to allow the protruding alignment feature of the mechanical part to be aligned with and to be inserted into the receiving alignment feature of the semiconductor die.
A method comprising:
- placing a first component on top of a substrate, wherein the first component includes a semiconductor die and a receiving alignment feature;
- and
- coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component.
An apparatus comprising:
- a first component including a semiconductor die and a receiving alignment feature;
- and
- a second component including a protruding alignment feature.
At least one computer readable storage medium comprising a set of instructions which, if executed by a processor, cause a computer to:
- place a first component on top of a substrate, wherein the first component includes a semiconductor die and a receiving alignment feature;
- and
- couple a second component to the first component, wherein a protruding alignment feature of the second component is to be inserted into the receiving alignment feature of the first component.
Dependencies are inferred from the claim text.