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US 2014/0175405 A1Published application
Electronic device package structure and manufacturing method thereof
AssigneeIndustrial Technology Research Institute
InventorsShu-Tang Yeh, Jia-Chong Ho
Life of this patent
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Abstract
A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.
Claims47
A package structure of an electronic device, comprising:
- a first substrate, having a first surface and a second surface opposite to the first surface;
- an electronic device, disposed on the first surface of the first substrate;
- an adhesive material, disposed on the first substrate and covering the electronic device and the first surface of the first substrate;
- and
- a second substrate, disposed above the first substrate and the adhesive material, wherein the second substrate has a third surface and a fourth surface opposite to the third surface,
- wherein at least one of the first substrate and the second substrate has a gas barrier structure embedded therein, and the first substrate and the second substrate are adhered to each other through the adhesive material, such that the electronic device and the gas barrier structure are located between the first substrate and the second substrate.
3 more elements
A package structure of an electronic device, comprising:
- a substrate, having a first surface and a second surface opposite to the first surface;
- an electronic device, disposed on the first surface of the substrate;
- an adhesive material, disposed on the substrate and covering the electronic device and the first surface of the substrate;
- and
- a hard coating layer, disposed on the adhesive material,
- wherein the substrate has a gas barrier structure embedded therein, and the electronic device and the gas barrier structure are located between the substrate and the hard coating layer.
3 more elements
A method for manufacturing a package structure of an electronic device, comprising:
- providing a substrate mounted on a carrier;
- forming a plurality of trenches in the substrate;
- and
- forming a gas barrier structure to fill the plurality of trenches.
1 more element
A method for manufacturing a package structure of an electronic device, comprising:
- providing a first substrate mounted on a carrier;
- forming a first gas barrier layer on the first substrate;
- and
- forming a plurality of trenches in the first gas barrier layer and defining a first gas barrier structure on the first substrate.
1 more element
Dependencies are inferred from the claim text.