Organic light-emitting diode package structure and method for forming the same
AssigneeShanghai Tianma Micro-Electronics Co., Ltd.
InventorsZhiyong XIONG, Bengang ZHAO, Xiaojun MA
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Abstract
An OLED package structure includes: a substrate, on which an organic light-emitting element is provided, and a cover plate having an annular groove surrounding the organic light-emitting element thereon. A packaging adhesive, partly inside the groove and partly outside the groove, adheres the cover plate to the substrate to seal the organic light-emitting element. In the OLED package structure according to the present invention, the thickness of the spacer can be smaller, so as to eliminate color mixture during an evaporation process and to prevent a Newton ring phenomenon in the OLED package structure.
Claims20
An organic light-emitting diode package structure, comprising:
- a substrate comprising an organic light-emitting element;
- a cover plate comprising an annular groove along a periphery of the cover plate, wherein the annular groove surrounds the organic light-emitting element;
- and
- a packaging adhesive having a thickness greater than a depth of the groove, wherein a portion of the packaging adhesive is located inside the groove of the cover plate, a portion of the packaging adhesive extends outside the groove of the cover plate, and the cover plate and the substrate are adhered to each other by the packaging adhesive, so as to seal the organic light-emitting element.
A method for forming an organic light-emitting diode package structure, the method comprising:
- providing an entire substrate comprising a plurality of substrate units, each substrate unit comprising an organic light-emitting element;
- providing an entire cover plate comprising a plurality of cover plate units, each cover plate unit comprising an annular groove;
- forming a packaging adhesive in the groove of each of the cover plate units, wherein a portion of the packaging adhesive is located inside the groove of each of the cover plate units and a portion of the packaging adhesive extends outside the groove of each of the cover plate units;
- pressing the entire cover plate and the entire substrate together, wherein the cover plate units are adhered to the substrate units with the packaging adhesive to seal each organic light-emitting element;
- and
- cutting the adhered entire cover plate and entire substrate to obtain a plurality of organic light-emitting diode package structures.
An organic light-emitting diode device, comprising:
- a substrate comprising an organic light-emitting device;
- a cover plate comprising an annular groove;
- and
- a packaging adhesive adhering the cover plate to the substrate so as to form a closed cavity sealing the organic light-emitting device, wherein a portion of the packaging adhesive is located inside the groove of the cover plate, and wherein the annular groove surrounds the organic light-emitting device.
Dependencies are inferred from the claim text.