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US 2014/0175321 A1Published application
Resin composition for heat dissipation and heat dissipating substrate manufactured by using the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKi Seok KIM, Hwa Young Lee, Ji Hye Shim
Life of this patent
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Abstract
Disclosed herein are a resin composition for heat dissipation, including: an insulating material; a first filler added to the insulating material and having a plate shaped carbon material; and a second filler added to the insulating material, and having a carbon material having a higher aspect ratio than the first filler.
Claims9
A resin composition for heat dissipation, comprising:
- an insulating material;
- a first filler added to the insulating material and having a plate shaped carbon material;
- and
- a second filler added to the insulating material, and having a carbon material having a higher aspect ratio than the first filler.
1 more element
A heat dissipating substrate manufactured by using a resin composition for heat dissipation, the resin composition having an insulating material;
- a first filler having a plate shaped carbon material;
- and a second filler having a carbon material having a higher aspect ratio than the first filler.
Dependencies are inferred from the claim text.